Processing technology that completes the chamfering of the back surface from the front in one step, called "Pascal processing."
Precision cutting using double-sided tape! The assembly process is eliminated, and the machining is completed in one step!
Meiwa's special technology "adhesive processing" allows for machining without the use of clamps by securely adhering aluminum materials and resin plates to a machine table with double-sided tape in a single process. The double-sided tape we use is very strong, but it can be easily peeled off using a special solvent. After peeling, machining is performed on multiple products simultaneously using a high-speed rotating and controlled machining center to enable mass production. When processing the backside, the resin plate used for adhesive processing can be utilized directly as a jig, which allows for high precision in backside machining as well. *For more details, please refer to the PDF document or feel free to contact us.
- Company：メイワ
- Price：Other
